The Fab of Things (FoT)Today’s fabrication facilities simply don’t support small volume activities well. With building costs in the billions of dollars, gross margin requirements—and the severe cost penalty of redesign—dictate what can and cannot be done. For example, in the semiconductor industry, Research and Development is often performed in shared facilities thousands of miles away from the designers. Prototyping is restricted to standardized flows and Packaging is usually performed in far off locations, resulting in weeks of delays due to shipping and customs issues. Through its unique ‘Cleanspace’ technology, Futrfab delivers superior work processes and dramatically decreased development cycle times rationalized to small volume needs for all customers. It is an affordable and flexible small volume manufacturing, assembly and packaging platform that will empower innovation and enable the soon to come Internet of Things (IoT). A one-stop resource for R&D, prototyping, production and packaging. Unique Features of a Futrfab Designers and engineers are hungry for a solution that will allow them to freely envision radical design changes, then test and implement those ideas in economically viable vehicles. Technology manufacturers are hungry for a solution that will allow small volumes of new and innovative products to get to market quicker and more efficiently. A novel solution is needed. A Futrfab. |
The Futrfab environment incorporates every aspect of the manufacturing process into one centralized location for small volume fabrication. |